Adherend delamination apparatus of film for printed circuit board of dry type

摘要

The present invention relates to a dry foreign material removal apparatus for a substrate film, comprising: a film supply unit (10) which supplies a bundle of substrate films along a conveyor; a cutting unit (20) which makes cuts on the substrate bundle to be easily cut while the substrate bundle supplied through the film supply unit (10) is allowed to pass downwards; a first peeling unit (30) which peels foreign materials attached to the substrate films by surface friction between the substrate films; a second peeling unit (40) which peels and pulverizes the remaining foreign materials attached to the substrate films by surface friction between the substrate films; a pulverization unit (50) which pulverizes the substrate film supplied through the second peeling unit (40) to be smaller than a predetermined size by a pulverization blade (51); and a dust removal unit (60) which induces the substrate film pulverized in the pulverization unit (50) to the upper end portion thereof to be induced downwards in a whirl shape along the inner circumferential surface, supplies the substrate film to the subsequent process, and discharges dust lighter than the substrate film upwards through a dust collection pipe (61).