Designs and methods to implement surface mounting structures of SIW

摘要

The present invention relates to a design and a structure of a high-frequency component used in a wireless communication system using a millimeter wave. Especially, it is to improve the electrical characteristics and miniaturization of a wireless communication system, by making a millimeter wave device designed by using a substrate integrated waveguide have a shape suitable for surface mounting and an integrated circuit. The high-frequency component includes a multilayer substrate; an input/output terminal; via holes; a via pad; a substrate integrated waveguide; and a co-planar waveguide (CPW) line.