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SMT Method of continuous absorption and installation for multi-stage loaded FPCB on SMT Tray

机译:SMT在SMT托盘上连续吸收和安装多级加载FPCB的方法

摘要

The present invention relates to a method for continuously adsorbing and mounting a multi-stage loaded flexible printed circuit board (FPCB) of an SMT tray. According to an embodiment of the present invention, the method for continuously adsorbing and mounting the multi-stage loaded FPCB of the SMT tray comprises: a first step of moving an adsorbing nozzle to a loaded position; a second step of applying vacuum to the adsorbing nozzle, and adsorbing an FPCB; a third step of moving the adsorbing nozzle to a mounted position; and a fourth step of removing the vacuum of the adsorbing nozzle, and mounting the FPCB on a reinforcing plate. The method for continuously adsorbing and mounting the multi-stage loaded FPCB of the SMT tray according to the present invention can shorten work processes.
机译:本发明涉及一种用于连续吸附和安装SMT托盘的多级加载的柔性印刷电路板(FPCB)的方法。根据本发明的一个实施例,连续吸附和安装SMT托盘的多级加载FPCB的方法包括:将吸附喷嘴移动到加载位置的第一步;第二步骤是向吸附喷嘴施加真空,并吸附FPCB。第三步骤,将吸附嘴移动到安装位置;第四步骤是去除吸附喷嘴的真空,并将FPCB安装在加强板上。根据本发明的用于连续吸附和安装SMT托盘的多级装载的FPCB的方法可以缩短工作过程。

著录项

  • 公开/公告号KR101812317B1

    专利类型

  • 公开/公告日2017-12-26

    原文格式PDF

  • 申请/专利权人 ORACOM CO. LTD.;

    申请/专利号KR20170007904

  • 发明设计人 JEONG TAE KOOK;

    申请日2017-01-17

  • 分类号H05K13;H05K13/04;

  • 国家 KR

  • 入库时间 2022-08-21 12:41:24

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