Heterogeneous integration of ultra-thin functional blocks by solid-state adhesive and selective transfer

摘要

The method includes coupling a device substrate to a carrier substrate; Aligning a portion of the device substrate with the host substrate; Separating a portion of the device substrate from the carrier substrate; And coupling the portion of the device substrate to the host substrate after separating the portion of the device substrate. The method includes coupling a device substrate to a carrier substrate with an adhesive between the device side of the device substrate and the carrier substrate; Coupling the device substrate to the carrier substrate and then thinning the device substrate; Aligning a portion of the thinned device substrate with a host substrate; Separating a portion of the device substrate from the carrier substrate; And coupling a separate portion of the device substrate to the host substrate. The apparatus includes a substrate including a device layer and a submicron thickness coupled to the host substrate in a stacked array.