System and Method for Detecting Degradation Trend of Arm Blade for Wafer Transfer Robot

摘要

The present invention relates to a system and a method for detecting a degradation trend of an arm blade for a wafer transfer robot, including a laser displacement sensor which measures a distance from a wafer-transferring arm blade, a control unit setting in advance initiation and termination sections of load and unload operation patterns of the arm blade, identifying each operation pattern by calculating a predetermined number of effective measured values received from the laser displacement sensor, and calculating an average value in each section, and a server analyzing the average value transmitted from the control unit and monitoring the deterioration trend in each section of the arm blade. The sagging or swelling degradation trend of the arm blade of the wafer transfer robot in each section is determined in real time so that the failure rate of the transferred wafer can be reduced based on wafer damage prevention.