首页> 外国专利> System and Method for Detecting Degradation Trend of Arm Blade for Wafer Transfer Robot

System and Method for Detecting Degradation Trend of Arm Blade for Wafer Transfer Robot

机译:晶圆转移机器人手臂叶片退化趋势检测系统及方法

摘要

The present invention relates to a laser displacement sensor comprising a laser displacement sensor for measuring a separation distance from a female blade for transferring a wafer and a start and end section of a load and unload operation pattern of the arm blade, A controller for calculating an effective measured value to identify each operation pattern and calculating an average value in each section, and a server for analyzing the average value transmitted from the controller and monitoring the deterioration trend in each section of the arm blade , Deterioration of the arm blade of the wafer transfer device in each of the corresponding sections is determined in real time so that the failure rate of the transferred wafer can be prevented in advance to reduce the defect rate of the wafer. A trend detection system and method are disclosed.
机译:激光位移传感器技术领域本发明涉及一种激光位移传感器,其包括:激光位移传感器,其用于测量与用于传送晶片的凹刀片之间的距离;以及臂刀片的加载和卸载操作模式的开始和结束部分;有效的测量值,用于识别每个操作模式并计算每个部分的平均值;以及服务器,用于分析从控制器发送的平均值并监视上臂刀片各部分的劣化趋势,晶圆上臂刀片的劣化实时确定每个相应部分中的传送装置,从而可以预先防止传送的晶片的故障率,从而降低晶片的缺陷率。公开了一种趋势检测系统和方法。

著录项

  • 公开/公告号KR101952840B1

    专利类型

  • 公开/公告日2019-03-04

    原文格式PDF

  • 申请/专利权人 주식회사 에스알티;

    申请/专利号KR20160148073

  • 发明设计人 손영만;

    申请日2016-11-08

  • 分类号H01L21/67;G01B11/02;G01B11/16;H01L21/66;H01L21/677;

  • 国家 KR

  • 入库时间 2022-08-21 11:49:01

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