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MEMS ENCAPSULATION FOR MEMS SENSE ELEMENTS AND WIRE BONDS
MEMS ENCAPSULATION FOR MEMS SENSE ELEMENTS AND WIRE BONDS
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机译:MEMS封装,用于MEMS传感元件和线键合
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摘要
The present invention relates to a MEMS sensor (100), which comprises: a housing (102) restricting an entrance hole and an inner portion (104) in fluid communication with outdoor environments for detection; a detecting die (116) coupled to the housing (102) to generate a signal based on the outdoor environments; and an encapsulant (124) applied to the detecting die (116) to protect the detecting die (116) without interrupting operation of the detecting die (116). Moreover, the encapsulant (124) is a composition containing non-crosslinking materials with organic backbone and silica thickener.
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