SILICON INGOT SLICING DEVICE USING MICRO BUBBLE AND WIRE ELECTRIC DISCHARGE AND SILICON SLICING METHOD

摘要

Disclosed are a silicon ingot slicing device using a micro bubble and a wire electric discharge machining, and a silicon ingot slicing method. The silicon ingot slicing device includes: a tank for containing a jig attached to a lower surface of the silicon ingot, a conductive adhesive layer attached between the silicon ingot and the jig, and de-ionized water (DIW); an electrode connected to the silicon ingot; a wire for cutting the silicon ingot while being transported in the vertical direction of the silicon ingot by a wire driving device; an additive injection unit for injecting an additive for generating micro bubbles into the tank; and a power supply unit for supplying power to the electrode and the wire so that arc discharge and electrolysis are performed between the silicon ingot and the wire. When a voltage is applied, micro bubbles are generated on a surface of the electrode and on a surface of the silicon ingot by the additive for generating the micro bubbles.