SILICON INGOT SLICING DEVICE USING MICRO BUBBLE AND WIRE ELECTRIC DISCHARGE AND SILICON SLICING METHOD

摘要

A silicon ingot cutting apparatus using micro bubbles and wire discharge machining, and a silicon ingot cutting method. In the silicon ingot cutting apparatus according to the present invention, the water ingestion tank may include a jig attached to the lower surface of the silicon ingot, a conductive adhesive layer adhered between the silicon ingot and the jig, and a purified water DIW; An electrode connected to the silicon ingot; A wire for cutting the silicon ingot while being transported in the vertical direction of the silicon ingot by the wire driving means; An additive injection unit injecting an additive for micro bubble generation into the water tank; And a power supply unit for supplying power to the electrode and the wire so that arc discharge and electrolysis are performed between the silicon ingot and the wire. When the voltage is applied, the electrode surface and the silicon ingot surface In which microbubbles are generated.