METHOD FOR DEPOSITING THIN FILM USING PLASMA ENHANCED ATOMIC LAYER DEPOSITION

摘要

A method for depositing a thin film using plasma enhanced atomic layer deposition (PEALD) according to an embodiment of the present invention comprises: a loading step of loading a substrate in a process chamber; an adsorption step of adsorbing a source gas on the substrate by supplying the source gas into the process chamber; a first purge step of purging the inside of the process chamber; a reaction step of supplying a reaction gas activated by plasma in the process chamber to react with the source gas adsorbed on the substrate; and a second purge step of purging the inside of the process chamber.;COPYRIGHT KIPO 2018