SCRUB CLEANING METHOD AND SCRUB CLEANING APPARATUS

摘要

Provided are a method and apparatus for cleaning a scrub to suppress occurrence of secondary contamination on a surface of a wafer by suppressing occurrence of liquid pooling due to a back flow of a cleaning liquid as a roller rotates. The method cleans a surface to be cleaned (Wa) by maintaining and rotating an outer circumferential edge (Wc) of a semiconductor substrate (W) by a plurality of rollers (2) and sliding and rubbing a cleaning member (3) to the surface to be cleaned (Wa). The method cleans the surface to be cleaned (Wa) of the semiconductor substrate (W) by maintaining a state where the cleaning member (3) is slid and rubbed to a center portion (O1) and moving the cleaning member (3) from the outer circumferential edge (Wc) of the semiconductor substrate (W) to an overhung distance (D) where a part of the cleaning member (3) protrudes after the cleaning member (3) is slid and rubbed to the center portion (O1) of the surface to be cleaned (Wa) of the semiconductor substrate (W).