SCRUB CLEANING METHOD AND SCRUB CLEANING APPARATUS

摘要

A scrubbing method and a scrubbing apparatus which suppress the generation of droplets due to the reverse flow of a cleaning liquid as the roller rotates and suppress the occurrence of secondary contamination on the surface of the wafer. The outer peripheral edge Wc of the semiconductor substrate W is rotated while being held by the plurality of rollers 2 and the cleaning member 3 is caused to slide on the cleaning face Wa of the semiconductor substrate, A scrubbing method for scrubbing a cleaning member (3), comprising the steps of: rubbing the cleaning member (3) against a central portion (O1) of a cleaning surface of a semiconductor substrate; , The cleaning surface of the semiconductor substrate is cleaned by moving the cleaning substrate from an outer peripheral edge (Wc) of the semiconductor substrate to an overhanging distance d where a part of the cleaning member protrudes.