FILLER AND SLURRY FOR THERMALLY CONDUCTIVE PAD COMPRISING POLYMER OF HIGH FILLING RATE AND THERMALLY CONDUCTIVE PAD INCLUDING THE SAME

摘要

The present invention relates to a filler and slurry for a thermally conductive pad comprising a polymer of high filling rate, and to a thermally conductive pad including the same, and particularly, to a filler and slurry for a thermally conductive pad comprising a polymer of high filling rate, and to a thermally conductive pad including the same, wherein the filler is composed of particles having different average particle diameters, and by coating the surface of small particles, the filling rate can be increased and the thermal conductivity performance can be improved.