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Method for depositing an aqueous indium or indium alloy plating bath and indium or indium alloy

机译:沉积水性铟或铟合金镀浴和铟或铟合金的方法

摘要

An aqueous indium or indium alloy plating bath comprising: - source of indium ion, - Mountain, A source of halide ions, Surfactants according to formula (I) (I) Wherein A is selected from branched or unbranched C 10 -C 15 alkyl; B is selected from the group consisting of hydrogen and alkyl; m is an integer ranging from 5 to 25; Each R is independently selected from hydrogen and methyl; And - dihydroxybenzene derivatives according to formula (II) (II) Wherein each X is independently selected from fluorine, chlorine, bromine, iodine, alkoxy and nitro; n is an integer ranging from 1 to 4, And depositing an indium or indium alloy in which the bath is used.
机译:水性铟或铟合金电镀液,包含:-铟离子源,-山,卤离子源,根据式(I)(I)的表面活性剂,其中A选自支链或直链C 10 -C 15 烷基; B选自氢和烷基; m是5至25的整数;每个R独立地选自氢和甲基;以及-根据式(II)(II)的二羟基苯衍生物,其中每个X独立地选自氟,氯,溴,碘,烷氧基和硝基; n为1至4的整数,并且沉积其中使用浴的铟或铟合金。

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