Coated semiconductor processing elements with chlorine and fluorine plasma corrosion resistance and their composite oxide coatings

摘要

A semiconductor processing member including a body and a plasma spray coating provided on the body is provided. Wherein the coating is an ABO or ABCO composite oxide solid solution composition wherein A, B and C are selected from the group consisting of La, Zr, Ce, Gd, Y, Yb and Si and O is an oxide. The coating imparts chlorine and fluorine plasma corrosion resistance, reduces particle generation during plasma etching, and prevents spoiling of the coating during wet cleaning of the semiconductor processing member.