METHOD AND SYSTEM FOR MEASURING PATTERN PLACEMENT ERROR ON A WAFER

摘要

A method and system for measuring the pattern placement errors (PPE) that detect and quantify pattern placement errors on a wafer are provided. The method of measuring the pattern placement error is a method of measuring the pattern placement error (PPE) on the wafer, comprising: providing a photomask pattern; adding at least one unit cell pattern to the photomask pattern, wherein each unit cell pattern includes at least one reference design pattern and at least one PPE verification design pattern; manufacturing a photomask from the photomask pattern having one or more unit cell patterns added thereto; patterning the wafer using the manufactured photomask; providing a microscope image of the patterned wafer; and measuring, as the pattern placement error, a displacement between the at least one reference design pattern and the at least one PPE confirmation design pattern.