首页> 外国专利> - - CURABLE SILICONE COMPOSITION FOR SEALING AN OPTICAL SEMICONDUCTOR ELEMENT METHOD OF PRODUCING A RESIN-SEALED OPTICAL SEMICONDUCTOR ELEMENT AND RESIN-SEALED OPTICAL SEMICONDUCTOR ELEMENT

- - CURABLE SILICONE COMPOSITION FOR SEALING AN OPTICAL SEMICONDUCTOR ELEMENT METHOD OF PRODUCING A RESIN-SEALED OPTICAL SEMICONDUCTOR ELEMENT AND RESIN-SEALED OPTICAL SEMICONDUCTOR ELEMENT

机译:-用于密封制造光学密封的光学半导体元件和树脂密封的光学半导体元件的光学半导体元件的可固化硅酮组合物

摘要

(A) having two or more silicon-bonded vinyl groups in one molecule and having C1-10Alkyl /RTI 4/2An organopolysiloxane lacking a siloxane unit represented by the formula (B) an organopolysiloxane represented by an average unit formula; (C) having three or more silicon-bonded hydrogen atoms in one molecule and having C1-10Organopolysiloxanes having alkyl and containing from 0.7 to 1.6 mass% of silicon-bonded hydrogen atoms; And (D) a hydrosilylation reaction catalyst, wherein the viscosity of said composition lacking component (D) at 25C and viscosity at 100C is in a specific relationship Can provide a cured product capable of efficiently performing resin sealing by transfer molding or compression molding while exhibiting excellent moldability and having low surface tackiness.;
机译:(A)在一个分子中具有两个或更多个与硅键合的乙烯基,并且具有C 1-10 烷基 4/2 表示的缺少硅氧烷单元的有机聚硅氧烷由式(B)表示的平均单元式为有机聚硅氧烷。 (C)在一个分子中具有三个或更多个与硅键合的氢原子的分子,并且具有具有烷基并且包含0.7至1.6质量%的与硅键合的氢原子的C 1-10 有机聚硅氧烷; (D)一种氢化硅烷化反应催化剂,其中,所述缺乏组分(D)的组合物在25℃下的粘度和在100℃下的粘度处于特定的关系,可以提供一种固化产物,该固化产物能够通过传递模塑或压缩模塑有效地进行树脂密封,同时表现出优异的成型性和低的表面粘性。

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