- Fan-out wafer level package using metal core solder ball in interconnector for Package of Package

摘要

A fan-out wafer-level package of the present invention includes a re-wiring layer, a semiconductor chip electrically connected to the re-wiring layer through a bump, and a protection layer that protects the semiconductor chip, wherein the upper surface of the semiconductor chip is exposed to be exposed And the interconnection is disposed at substantially the same level at the outer periphery of the semiconductor chip, the lower portion is electrically connected to the rewiring layer, and the upper portion is not covered by the protection member, Wherein the metal core includes at least one of copper (Cu), nickel (Ni), and silver (Ag). The solder ball includes a metal core and a solder buffer between the metal core and the protection member. . According to the structure of the present invention as described above, the stress can be minimized despite the difference in thermal expansion coefficient between the metal and the mold.;