MICROELECTRONIC PACKAGE HAVING A PASSIVE MICROELECTRONIC DEVICE DISPOSED WITHIN A PACKAGE BODY METHOD OF FABRICATING IT AND COMPUTING DEVICE COMPRISING IT

摘要

A microelectronic package is disclosed that includes a passive microelectronic device disposed within a package body, wherein the package body is part of a microelectronic package that provides support and / or rigidity to the microelectronic package. In a flip-chip microelectronic package, the package body may include a microelectronic substrate to which the active microelectronic device is electrically attached. In a buried device type microelectronic package, the package body may include a material in which the active microelectronic device is embedded.