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IMPROVING METAL CONTACTS TO GROUP IV SEMICONDUCTORS BY INSERTING INTERFACIAL ATOMIC MONOLAYERS

机译:通过插入界面原子单分子膜将金属接触提高至IV族半导体

摘要

(IV) junctions by inserting a single layer of Group V or Group III atoms at the interface between the metal and the semiconductor, inserting a bilayer made of one single layer each, or inserting a plurality of such bilayers, A technique for decreasing the number of pixels is disclosed. The resulting low resistivity metal-IV semiconductor junctions have low resistivity in semiconductor devices including electronic devices (e.g., transistors, diodes, etc.) and optoelectronic devices (e.g., lasers, solar cells, photodetectors, As an electrode, and / or as a metal source and / or drain region (or portion thereof) in a field effect transistor (FET). The single layers of Group III and V atoms are aligned layers of atoms that are formed on the surface of the Group IV semiconductor and are chemically bonded to the surface atoms of the Group IV semiconductor.
机译:(IV)通过在金属和半导体之间的界面上插入单层的V族或III族原子的层,插入分别由单层组成的双层或插入多个这样的双层来进行结的方法。公开了像素数。所得的低电阻率金属-IV半导体结在包括电子器件(例如,晶体管,二极管等)和光电器件(例如,激光器,太阳能电池,光电探测器,作为电极和/或作为半导体器件)的半导体器件中具有低电阻率。场效应晶体管(FET)中的金属源极和/或漏极区(或其一部分)。III和V组原子的单层是在IV组半导体表面上形成并化学键合的原子排列的层到IV族半导体的表面原子。

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