ETCHANT ADDITIVES AND ETCHANT USING THE SAME

摘要

The present invention relates to an etching additive for controlling the etching rate for controlling the etching direction, an etching solution containing the etching additive, and a method of manufacturing a wiring using the etching additive. In the case of using the etching additive of the present invention, the etching rate and direction in the vertical and horizontal directions can be controlled in the etching process for forming a circuit, so that the top portion from the bottom portion of the circuit has a 1: 1 ratio It is possible to secure a linearity close to that of the circuit and to achieve a high etch factor close to the infinite etch factor of the circuit.