KEY MATERIAL FOR HIGH-TEMPERATURE APPLICATIONS

摘要

FIELD: machine building.;SUBSTANCE: invention relates to the field of mechanical engineering and can be used in devices in which operation it is possible to release a large amount of heat, leading to a thermal expansion of a key and wedging of the device. Key composite material is a matrix of polycrystalline silicon reinforced with silicon carbide fibers.;EFFECT: material with low values of coefficient of thermal expansion and dry friction on steel can be used at temperatures up to 1,300 °C; in addition, the material has a high hardness and resistance to oxidation when heated.;1 cl, 1 dwg, 3 tbl