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Magazine for portion-wise picking up of isolated electronic components present as bulk material, and device and method for portionwise transferring of the components
Magazine for portion-wise picking up of isolated electronic components present as bulk material, and device and method for portionwise transferring of the components
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机译:用于分批拾取作为散装材料存在的隔离电子组件的盒以及用于分批转移组件的装置和方法
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摘要
A magazine (200) is described for the portion-wise picking up of isolated bulk electronic components (298). The magazine (200) comprises (a) a receiving structure (110) having a plurality of closable receiving cavities (112, 112a) disposed along a longitudinal axis (100a) of the receiving structure (110); (B) a cover structure (120) which is slidably disposed on an upper side of the receiving structure (110) along the longitudinal axis (110a), so that in a closed position of the cover structure (120) all receiving cavities (112, 112a) are covered and in one Opening position of a plurality of opening positions at least one receiving cavity (112) is free; and (c) a closure film (225) which surrounds the lid structure (120) along the longitudinal axis (100a) in the form of a closed band, at least a portion of the closure film (225) being releasably connected to the receiving structure (110). A device (430) for transferring in portions components (298) from such a magazine (200) into a reservoir (490) for a component supply device is also described. Furthermore, a method for portionwise transferring components from such a magazine (200) into such a reservoir (490) will be described.
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