Method for assembling at least one chip with a wired element, electronic chip with deformable connection element, method for manufacturing a plurality of chips and assembly of at least one chip with a wired element

摘要

The method involves arranging electrically conductive wire elements (5a, 5b) in corresponding grooves (4a, 4b), of an electronic chip, defined by an active element (8') i.e. active electronic component, and another active element that are connected by a connection element (6) made of thermoplastic/thermosetting polymer material or fusible material. The active elements are clamped together to deform the connection element until fixing of the wire elements in the grooves. The clamping of the active elements is released after which the connection element remains in deformed position. Independent claims are also included for the following: (1) an electronic chip comprising a connection element (2) a method for fabricating an electronic chip.