SYSTEM CONFIGURED FOR SPUTTER DEPOSITION ON A SUBSTRATE, SHIELDING DEVICE FOR A SPUTTER DEPOSITION CHAMBER, AND METHOD FOR PROVIDING AN ELECTRICAL SHIELDING IN A SPUTTER DEPOSITION CHAMBER

摘要

The present disclosure provides a system configured for sputter deposition on a substrate. The system includes a sputter deposition chamber having a processing zone, one or more sputter deposition sources arranged at a first side of the processing zone, and a shielding device arranged at a second side of the processing zone, wherein the shielding device includes a frame assembly mounted to the sputter deposition chamber and one or more conductive sheets detachably mounted on the frame assembly, wherein the one or more conductive sheets provide a surface arranged along the processing zone.