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SLIT STRESS MODULATION IN SEMICONDUCTOR SUBSTRATES
SLIT STRESS MODULATION IN SEMICONDUCTOR SUBSTRATES
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机译:半导体基底中的切应力调制
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摘要
A disclosed example to modulate slit stress in a semiconductor substrate includes controlling a first process to apply a first material to a semiconductor substrate. The semiconductor substrate includes a slit between adjacent stacked transistor layers. The first material coats walls of the slit to reduce a first width of the slit between the adjacent stacked transistor layers to a second width. A second process is controlled to apply a second material to the semiconductor substrate. The second material is to be deposited in the second width of the slit. The first material and the second material are to form a solid structure in the slit between the adjacent stacked transistor layers.
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