首页> 外国专利> COPPER ALLOY FOR ELECTRONIC/ELECTRICAL DEVICE, MEMBER FOR PLASTICALLY DEFORMING COPPER ALLOY FOR ELECTRONIC/ELECTRICAL DEVICE, COMPONENT FOR ELECTRONIC/ELECTRICAL DEVICE, TERMINAL, AND BUS BAR

COPPER ALLOY FOR ELECTRONIC/ELECTRICAL DEVICE, MEMBER FOR PLASTICALLY DEFORMING COPPER ALLOY FOR ELECTRONIC/ELECTRICAL DEVICE, COMPONENT FOR ELECTRONIC/ELECTRICAL DEVICE, TERMINAL, AND BUS BAR

机译:电子/电气设备用铜合金,电子/电气设备用塑性变形铜合金,电子/电气设备,端子和母线的成分

摘要

The present invention is characterized by containing 0.1 to less than 0.5 mass% of Mg, the balance being Cu and unavoidable impurities, and is further characterized in that in a tension test, when the ratio dà t /dµ t defined by true stress à t and true strain µ t is plotted on the vertical axis and true strain µ t is plotted on the horizontal axis, a strain region is included in which the gradient of dà t /dµ t is positive.
机译:本发明的特征在于含有0.1质量%至小于0.5质量%的Mg,余量为Cu和不可避免的杂质,并且进一步的特征在于,在拉伸试验中,当由真实应力Δt定义的比率d / t / d / t时纵轴为真应变μt,横轴为真实应变μt,在应变区域中,d t /dμt的斜率为正。

著录项

  • 公开/公告号EP3348658A4

    专利类型

  • 公开/公告日2019-04-10

    原文格式PDF

  • 申请/专利权人 MITSUBISHI MATERIALS CORPORATION;

    申请/专利号EP20160844420

  • 发明设计人 MATSUNAGA HIROTAKA;MAKI KAZUNARI;

    申请日2016-09-08

  • 分类号C22C9;H01B1/02;H01B5/02;C22F1/08;C22F1;H02G5;

  • 国家 EP

  • 入库时间 2022-08-21 12:29:29

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