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ULTRA HIGH DENSITY THIN FILM TRANSISTOR SUBSTRATE HAVING LOW LINE RESISTANCE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
ULTRA HIGH DENSITY THIN FILM TRANSISTOR SUBSTRATE HAVING LOW LINE RESISTANCE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
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机译:具有低线电阻结构的超高密度薄膜晶体管基板及其制造方法
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摘要
The present invention relates to the thin film transistor substrates of a ultra high density to have a low resistance silk structure, to its manufacturing method. Membrane according to the invention transistor substrate includes: a gate wire, a data line, a pixel region, a gate insulation film, semi-conductor layer, an auxiliary gate line and an auxiliary data line. Gate wire continues in a first direction on a substrate. In a second direction on substrate, data line continues. Gate insulation film and semiconductor layer are sequentially laminated, and when being arranged on a position, gate wire and data line intersect, when upper in an island shape, between gate wire and data line. Auxiliary gate line is contacted with a surface of gate wire and middle continuation in a first direction, when having line segment shape Uncrossed with data line. Auxiliary data line contacts with a surface of data line and continues in second direction, when having line segment shape Uncrossed with gate wire. ;Copyright KIPO 2017
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