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SPUTTERING TARGET INCLUDING COBALT/CHROMIUM/PLATINUM/BORON/RHENIUM, LAYER INCLUDING COBALT/CHROMIUM/PLATINUM/BORON/RHENIUM AND METHOD FOR MANUFACTURING SPUTTERING TARGET
SPUTTERING TARGET INCLUDING COBALT/CHROMIUM/PLATINUM/BORON/RHENIUM, LAYER INCLUDING COBALT/CHROMIUM/PLATINUM/BORON/RHENIUM AND METHOD FOR MANUFACTURING SPUTTERING TARGET
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机译:包括钴/铬/铂/硼/ R的溅射靶,包括钴/铬/铂/硼/ R的层和制造溅射靶的方法
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摘要
To provide: a sputtering target including cobalt/chromium/platinum/boron/rhenium; a layer including cobalt/chromium/platinum/boron/rhenium; and a method for manufacturing the sputtering target.SOLUTION: In the sputtering target including cobalt/chromium/platinum/boron/rhenium, on the basis of the total number of atoms, the content of cobalt is larger than 50 atom%; the content of chromium is 2 atom% or more and 18 atom% or less; the content of platinum is 9 atom% or more and 30 atom% or less; the content of boron is 2 atom% or more and 14 atom% or less; and the content of rhenium is 2 atom% or more and 8 atom% or less. The probability of accidental fire occurrence can be substantially reduced by controlling the constituent of the sputtering target including cobalt/chromium/platinum/boron/rhenium, and stability during sputtering can be enhanced.SELECTED DRAWING: Figure 1
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