首页> 外国专利> MACHINING PROGRAM ANALYSIS DEVICE, MACHINE TOOL PROVIDED WITH THE SAME, MACHINING PROGRAM ANALYSIS PROGRAM AND MACHINING PROGRAM ANALYSIS METHOD

MACHINING PROGRAM ANALYSIS DEVICE, MACHINE TOOL PROVIDED WITH THE SAME, MACHINING PROGRAM ANALYSIS PROGRAM AND MACHINING PROGRAM ANALYSIS METHOD

机译:机械加工程序分析装置,具有该机械加工程序的机床,机械加工程序分析程序和机械加工程序分析方法

摘要

PROBLEM TO BE SOLVED: To provide a machining program analysis device and a machine tool equipped with the same, and a machining program analysis program and a machining program analysis method capable of determining with high accuracy positions where flaws have occurred on a machining surface while an analysis time can be predicted.;SOLUTION: A machining program analysis device comprises: a processing path division unit 43 that divides a processing path commanded by a processing program into a plurality of unit processing paths which are adjacent to each other; and an isolated command point detection unit 46 that detects command points in which command points adjacent to each other in the unit processing paths are missing as isolated command points based on respective positional relationships between the command points that configure the adjacent unit processing paths.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2019,JPO&INPIT
机译:解决的问题:提供一种加工程序分析装置和配备有该加工程序分析装置的机床,以及能够高精度地确定在加工过程中加工表面上出现缺陷的位置的加工程序分析程序和加工程序分析方法。解决方案:一种加工程序分析装置,包括:加工路径划分单元43,其将由加工程序指令的加工路径划分为彼此相邻的多个单位加工路径。隔离命令点检测单元46基于构成相邻单元处理路径的命令点之间的各自位置关系,将单元处理路径中彼此相邻的命令点丢失的命令点检测为隔离命令点。图纸:图1;版权:(C)2019,JPO&INPIT

著录项

  • 公开/公告号JP2019101799A

    专利类型

  • 公开/公告日2019-06-24

    原文格式PDF

  • 申请/专利权人 DMG MORI SEIKI CO LTD;

    申请/专利号JP20170232531

  • 发明设计人 TSUKUI YOJI;ITO MICHIHIKO;HOZUMI TAKAHITO;

    申请日2017-12-04

  • 分类号G05B19/4069;

  • 国家 JP

  • 入库时间 2022-08-21 12:24:27

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