To provide a resin composition which is suitable as a resin material used for electric/electronic components, is excellent in heat resistance, insulating property and mechanical strength, and has flexibility enough to enable the resin composition to be molded.SOLUTION: The resin composition contains a resin component including: a benzimidazole unit; and at least any one of an imide unit and a precursor unit thereof. A mole ratio being a mole quantity of the benzimidazole unit to the total mole quantity of: the benzimidazole unit; and at least any one of the imide unit and the precursor unit thereof is 5 mol% or more and 95 mol% or less.SELECTED DRAWING: Figure 1
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