熱硬化性樹脂組成物、並びに、それを用いたプリプレグ、樹脂付金属箔、樹脂フィルム、金属張積層板及び配線基板

摘要

To provide a thermosetting resin composition which is excellent in workability and handling property while maintaining dielectric characteristics, can also suppress warpage after molding, and can sufficiently suppress occurrence of thermal degradation to dielectric characteristics.SOLUTION: A thermosetting resin composition contains (A) a modified polyphenylene ether compound having a group represented by the following formula 1 at the terminal, (B) a crosslinking agent having an ethylenically unsaturated double bond having a molecular weight of 10,000 or less and a functional group equivalent of 500 or more, (C) a hydrogenated styrene thermoplastic elastomer having a weight average molecular weight of 10,000 or more, (D) a curing accelerator, (E) an inorganic filler, and (F) a flame retardant. In formula (1), Rrepresents a hydrogen atom or an alkyl group.SELECTED DRAWING: Figure 1