首页> 外国专利> METHOD OF ARRAYING MICRO-LED CHIP FOR PRODUCING LED DISPLAY PANEL AND MULTI-CHIP CARRIER USED THEREFOR

METHOD OF ARRAYING MICRO-LED CHIP FOR PRODUCING LED DISPLAY PANEL AND MULTI-CHIP CARRIER USED THEREFOR

机译:用于制作LED显示面板的微LED芯片的阵列方法以及使用该芯片的多芯片载体

摘要

PROBLEM TO BE SOLVED: To disclose a method for arraying micro-LED chips.;SOLUTION: A method of arraying micro-LED chips includes the steps of: preparing a multi-chip carrier on which a plurality of chip pockets are formed, the chip pockets being depressurized through suction holes; having each of the micro-LED chips closely attached to the bottom of each of the chip pockets, thereby capturing the micro-LED chips inside the chip pockets; and placing the micro-LED chips captured by the chip pockets on a substrate. Each of the chip pockets includes a slope that continues from an entrance to the bottom, the entrance having a width larger than the bottom, and by virtue of the slope, a center-to-center distance between the micro-LED chips placed on the substrate and a center-to-center distance between the chip pockets are identical to each other.;SELECTED DRAWING: Figure 2;COPYRIGHT: (C)2019,JPO&INPIT
机译:解决的问题:公开一种用于排列微型LED芯片的方法。解决方案:一种排列微型LED芯片的方法包括以下步骤:准备在其上形成有多个芯片袋的多芯片载体,该芯片口袋通过吸气孔减压;使每个微型LED芯片紧密地附接到每个芯片袋的底部,从而将微型LED芯片捕获在芯片袋内;将芯片袋所捕获的微型LED芯片放置在基板上。每个芯片袋包括从入口到底部连续的斜面,该入口的宽度大于底部的宽度,并且借助于该斜面,放置在芯片上的微型LED芯片之间的中心到中心的距离。基片和芯片腔之间的中心距彼此相同。;选定的图纸:图2;版权:(C)2019,JPO&INPIT

著录项

  • 公开/公告号JP2019140380A

    专利类型

  • 公开/公告日2019-08-22

    原文格式PDF

  • 申请/专利权人 LUMENS CO LTD;

    申请/专利号JP20180230832

  • 申请日2018-12-10

  • 分类号H01L33/48;H01L21/673;H01L21/677;H01L21/60;H05K13/04;H05K13/02;G09F9/33;G09F9;

  • 国家 JP

  • 入库时间 2022-08-21 12:24:01

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