Bottom-up method for forming a wiring structure on a substrate

摘要

A method is provided for forming a structure on a substrate. The method comprises depositing a fluid comprising electrically polarizable nanoparticles on a substrate to define a wetted region, and using the first electrode and the second electrode to flow the fluid over the region. Applying an alternating electric field to the plurality to assemble the plurality of nanoparticles to form an elongated structure extending from the first electrode to the second electrode, and to leave the elongated structure on the substrate. Removing the fluid.