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Paste, paste for sealing, paste for forming conductor layer, and method for producing low melting point composition powder and paste

机译:糊剂,密封用糊剂,导体层形成用糊剂以及低熔点组合物粉末和糊剂的制造方法

摘要

Problem to be solved: to provide a paste containing a low melting point composition powder which is well fluidized by heat treatment in a low temperature region and capable of forming a highly reliable sealing or conductive layer by cooling solidification, and a method of manufacturing the same.Solution: a paste comprising an organic solvent and a low melting point composition powder, and the low melting point composition powder is formed from a crushed crystallized glass, and the crystallized glass is a crystallized form of glass having a glass transition point at a temperature of less than 100.degree. C.A method for producing a low melting point composition powder containing a step of crystallizing glass having a glass transition point of less than 100.degree. C. and crystallizing the crystallized glass and pulverizing the crystallized glass, and making a paste comprising the step of mixing the powder with an organic solvent Construction method.No selection
机译:要解决的问题:提供一种包含低熔点组合物粉末的糊剂及其制造方法,所述糊剂通过在低温区域中的热处理而良好地流化并且能够通过冷却固化而形成高度可靠的密封或导电层。 。解决方案:由有机溶剂和低熔点组合物粉末组成的糊剂,该低熔点组合物粉末由压碎的微晶玻璃形成,并且该微晶玻璃是在0℃的温度下具有玻璃化转变点的玻璃的晶形。小于100.degree C.一种生产低熔点组合物粉末的方法,该方法包括使玻璃化点小于100℃的玻璃结晶的步骤。 C.使微晶玻璃结晶化,然后将微晶玻璃粉碎,制成糊剂,其包括将粉末与有机溶剂混合的步骤。没有选择

著录项

  • 公开/公告号JP2019011228A

    专利类型

  • 公开/公告日2019-01-24

    原文格式PDF

  • 申请/专利权人 NIHON YAMAMURA GLASS CO LTD;

    申请/专利号JP20170129709

  • 发明设计人 池田 拓朗;

    申请日2017-06-30

  • 分类号C03C8/24;H01L23/10;

  • 国家 JP

  • 入库时间 2022-08-21 12:22:10

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