HEAT DISSIPATING SUBSTRATE, HEAT DISSIPATING SUBSTRATE ELECTRODE, SEMICONDUCTOR PACKAGE, SEMICONDUCTOR MODULE, AND MANUFACTURING METHOD OF HEAT DISSIPATING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a heat dissipating substrate in which a decrease in the thermal conductivity in the thickness direction is small after a heat cycle test.SOLUTION: A manufacturing method of a heat dissipating substrate includes coating an insert metal on the inner wall surface of a through hole penetrating a plate-shaped core substrate made of a first metal in a thickness direction, filling the through hole with an insert made of a second metal having a thermal conductivity higher than that of the first metal, disposing a plate-like heat conductive member made of a third metal having a thermal conductivity higher than that of the first metal on the front surface and the back surface of the main body to form a laminate, and pressing and heating the laminate to a temperature lower than the melting point of all of the first metal, the second metal, and the third metal.SELECTED DRAWING: None