IMAGING SENSOR MOUNTING SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND MOUNTING SUBSTRATE ASSEMBLY

摘要

To provide an imaging sensor mounting substrate which can suppress an occurrence of warpage and can be thinned, a method of manufacturing the same, and a mounting substrate assembly.SOLUTION: An imaging sensor mounting substrate 1 for mounting an imaging sensor 21 includes a wiring region 16 including a base insulating layer 4, a metal wire 9 disposed on an upper side of the base insulating layer, and a cover insulating layer 6 disposed on an upper side of the metal wire 9. Equivalent elastic modulus of the wiring region 16 is 5 GPa or more and 55 GPa or less.SELECTED DRAWING: Figure 2