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LATTICE STRUCTURE IN COOLING PATHWAY BY ADDITIVE MANUFACTURE

机译:增材制造冷却通道中的晶格结构

摘要

To provide a hot gas path (HGP) component including a cooling pathway that includes a lattice structure therein.SOLUTION: A hot gas path component of an industrial machine includes a cooling pathway with a lattice structure therein. The component and lattice structure are made by additive manufacturing. The component includes an outer surface exposed to a working fluid having a high temperature; a thermal barrier coating over the outer surface; an internal cooling circuit; and a cooling pathway in communication with the internal cooling circuit and extending towards the outer surface. The lattice structure is in the cooling pathway at the outer surface. The lattice structure is configured to support the thermal barrier coating over the cooling pathway and, in response to fracture in the thermal barrier coating occurring over the cooling pathway, allow a cooling medium from the internal cooling circuit to pass through the lattice structure.SELECTED DRAWING: Figure 5
机译:提供一种热气路径(HGP)组件,该组件包括在其中包括网格结构的冷却路径。解决方案:工业机械的热气路径组件在其中包括具有网格结构的冷却路径。部件和晶格结构是通过增材制造而制成的。该部件包括暴露于高温的工作流体的外表面;外表面的热障涂层;内部冷却回路;冷却路径与内部冷却回路连通并向外表面延伸。晶格结构在外表面的冷却路径中。晶格结构配置为在冷却路径上支撑隔热涂层,并响应于在冷却通道上方发生的隔热涂层破裂,允许来自内部冷却回路的冷却介质通过晶格结构。 :图5

著录项

  • 公开/公告号JP2018204603A

    专利类型

  • 公开/公告日2018-12-27

    原文格式PDF

  • 申请/专利权人 GENERAL ELECTRIC CO GE;

    申请/专利号JP20180063952

  • 发明设计人 LACY BENJAMIN PAUL;MORGAN VICTOR JOHN;

    申请日2018-03-29

  • 分类号F01D5/18;F01D9/02;F01D25/12;F02C7/18;

  • 国家 JP

  • 入库时间 2022-08-21 12:21:31

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