A preparation (11F) of the present disclosure includes an image sensor (B01) having an imaging area on a front surface, a package (12F) electrically connected to the image sensor (B01), and a transparent plate (31 F) which opposes the front surface of the image sensor with a mounting medium therebetween. On the surface of the transparent plate (31 F), a first groove (41 b) and a second groove (41c) are formed. The image sensor (B01) is disposed between the first groove (41 b) and the second groove (41c).
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