THERMAL RESISTANCE MEASURING DEVICE AND THERMAL RESISTANCE MEASURING METHOD

摘要

To make it possible to accurately and easily detect the thermal resistance between a junction and a case and the thermal resistance at the boundary between constitutional structures without using an expensive measuring instrument and software.SOLUTION: A thermal resistance measuring method includes: recording, in memory 5, two-system transient thermal resistance values (A, B) measured with the arrangement of a heat sink 3 with respect to (a junction of) an IC package 1 incorporated with an IC 2 in a first state and a second state; calculating, in a calculation unit 6, differential values of curves A, B of the transient thermal resistance; displaying, on a display unit 7, transient thermal resistance curves A, B and displaying, while overlapping on the display, changes (curves) of thermal resistance differential values that are results of differentiation of the curves A, B; and for example, visually recognizing and detecting the thermal resistance θjc between the junction and a case.SELECTED DRAWING: Figure 1