PROBLEM TO BE SOLVED: To provide a processing method for a package substrate, by which occurrence of metal burr is hindered and occurrence of abnormal wear of a cutting blade can be prevented.;SOLUTION: A processing method for a package substrate comprising: a metal frame body in which a plurality of electrodes are formed along a plurality of dividing lines; a plurality of device chips; and a molding resin layer 14 stacked on a rear surface side of the metal frame body so as to cover the plurality of device chips, comprises: a step of laying a cover member 18 on the surface of the package substrate from which the electrodes 12 are exposed along the dividing lines; a step of cutting the package substrate with the cover member attached thereto, by means of a first cutting blade 28 from above the covering member and forming cutting grooves 29 on the surface and along the dividing lines, the cutting grooves having a depth at which the electrodes are not fully cut; and a step of, after peeling the covering member, cutting respective centers of the cutting grooves with a second cutting blade thinner than the first cutting blade and dividing the package substrate into individual package device chips.;SELECTED DRAWING: Figure 5;COPYRIGHT: (C)2019,JPO&INPIT
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