セラミックパッケージにおける電極接続構造

摘要

To provide a low-cost electrode connection structure in a ceramic package capable of being miniaturized without increasing the height direction.SOLUTION: In an electrode connection structure in a ceramic package in which a second substrate 2 is stacked on a first substrate 1, a first electrode 31 and a second electrode 32 are formed on the upper surface of the first substrate 1. A through portion 5 is formed on the second substrate 2 such that the first electrode 31 and the second electrode 32 are exposed, and an electrically-conductive adhesive 6 for connecting the first electrode 31 and the second electrode 32 are applied to the upper surface of the first electrode 31, which is the inside of the through portion 5.SELECTED DRAWING: Figure 3