Carrier for double-side polishing apparatus, double-side polishing apparatus and double-side polishing method

摘要

The present invention relates to a double-side polishing apparatus for double-side polishing a semiconductor silicon wafer, the semiconductor silicon being disposed between upper and lower surface plates to which polishing cloths are respectively attached and sandwiched between the upper and lower surface plates during polishing. A carrier for a double-side polishing apparatus in which a holding hole for holding a wafer is formed, wherein the carrier for a double-side polishing apparatus is made of a resin, and an average value of contact angles with respect to pure water on the front and back surfaces contacting the polishing cloth Is a carrier for a double-side polishing apparatus in which the difference between the average contact angles of the front and back surfaces is within 5 °. This provides a carrier for a double-side polishing apparatus that can improve the polishing rate of a semiconductor silicon wafer using a resin carrier, a double-side polishing apparatus and a double-side polishing method using the same.