Solidification compound, solidfied material, semiconductor-encapsulating material, semiconductor device, prepreg, printed circuit board, resist nozzle plate, the manufacture of film, laminated substrate, fiber reinforced composite material, molded product

摘要

PROBLEM TO BE SOLVED: To provide a curable composition that has high adhesion and can yield a cured product with excellent properties of heat resistance, dielectric properties, and low expansion rate, and provide the cured product, a semiconductor sealing material, a semiconductor device, a prepreg, a print circuit board, a flexible wiring board, a build-up film, a build-up substrate, a fiber-reinforced composite material, and a molding.SOLUTION: A curable composition comprises one or more condensed polycyclic aromatic cyanate ester compound (A) selected from compounds represented by formula (A1) and structural formula (A2), and a monocyclic aromatic cyanate ester compound (B) wherein a plurality of monocyclic compounds having cyanato groups on aromatic nuclei are bonded together directly or through linking groups.SELECTED DRAWING: None