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Methods and systems for connecting interlayer conductors and components in 3D structures, structural components, and structural electronic, electromagnetic, and electromechanical components / devices
Methods and systems for connecting interlayer conductors and components in 3D structures, structural components, and structural electronic, electromagnetic, and electromechanical components / devices
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机译:用于连接3D结构中的层间导体和组件,结构组件以及结构电子,电磁和机电组件/设备的方法和系统
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摘要
The present invention provides systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.
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