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METHODS AND SYSTEM FOR CONNECTING INTER-LAYER CONDUCTORS AND COMPONENTS IN 3D STRUCTURES, STRUCTURAL COMPONENTS OR STRUCTURAL ELECTRONIC ELECTROMAGNETIC AND ELECTROMECHANICAL COMPONENTS/DEVICES
METHODS AND SYSTEM FOR CONNECTING INTER-LAYER CONDUCTORS AND COMPONENTS IN 3D STRUCTURES, STRUCTURAL COMPONENTS OR STRUCTURAL ELECTRONIC ELECTROMAGNETIC AND ELECTROMECHANICAL COMPONENTS/DEVICES
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机译:在3D结构,结构组件或结构电子电磁和机电组件/设备中连接层间导体和组件的方法和系统
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摘要
The present invention provides systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.
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