首页> 外国专利> Cyanate esters, cyanate ester resin, the manufacturing method of cyanate esters, hardening resin composition, its solidfied material, bonding film is for assembling, semiconductor-encapsulating material, prepreg and circuit board

Cyanate esters, cyanate ester resin, the manufacturing method of cyanate esters, hardening resin composition, its solidfied material, bonding film is for assembling, semiconductor-encapsulating material, prepreg and circuit board

机译:氰酸酯,氰酸酯树脂,氰酸酯的制造方法,固化性树脂组合物,其固化材料,用于组装的接合膜,半导体密封材料,半固化片和电路板

摘要

PROBLEM TO BE SOLVED: To provide a cyanate ester compound small in dielectric constant and dielectric loss tangent of the resulting cured article and excellent in heat resistance, pyrolytic property and fire retardance, a cyanate ester resin, a manufacturing method of the cyanate ester compound, a curable resin composition, a cured article thereof, an adhesive film for build up, a semiconductor encapsulation material, a prepreg and a circuit board.SOLUTION: There is provided a cyanate ester compound having a diarylene [b,d]furan structure, where at least one arylene group of two arylene groups forming the diarylene [b,d]furan structure has a naphthylene skeleton and both of the two arylene group have an a cyanato group on their aromatic ring.SELECTED DRAWING: None
机译:解决的问题:为了提供所得到的固化物的介电常数和介电损耗角正切小且耐热性,热解性和阻燃性优异的氰酸酯化合物,氰酸酯树脂,该氰酸酯化合物的制造方法,固化性树脂组合物,其固化物,用于形成的粘合膜,半导体封装材料,半固化片和电路板。解决方案:提供具有二芳撑[b,d]呋喃结构的氰酸酯化合物,其中形成二亚芳基[b,d]呋喃结构的两个亚芳基中的至少一个亚芳基具有亚萘基骨架,并且两个亚芳基均在其芳环上具有氰基。

著录项

  • 公开/公告号JP6464721B2

    专利类型

  • 公开/公告日2019-02-06

    原文格式PDF

  • 申请/专利权人 DIC株式会社;

    申请/专利号JP20140257341

  • 发明设计人 高橋 歩;佐藤 泰;

    申请日2014-12-19

  • 分类号C07D307/77;C08G73/06;C08L79/04;C08K3;C08J5/24;C09J7/20;C09J11/06;C09J179/04;H05K1/03;

  • 国家 JP

  • 入库时间 2022-08-21 12:17:28

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