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Cyanate esters, cyanate ester resin, the manufacturing method of cyanate esters, hardening resin composition, its solidfied material, bonding film is for assembling, semiconductor-encapsulating material, prepreg and circuit board
Cyanate esters, cyanate ester resin, the manufacturing method of cyanate esters, hardening resin composition, its solidfied material, bonding film is for assembling, semiconductor-encapsulating material, prepreg and circuit board
PROBLEM TO BE SOLVED: To provide a cyanate ester compound small in dielectric constant and dielectric loss tangent of the resulting cured article and excellent in heat resistance, pyrolytic property and fire retardance, a cyanate ester resin, a manufacturing method of the cyanate ester compound, a curable resin composition, a cured article thereof, an adhesive film for build up, a semiconductor encapsulation material, a prepreg and a circuit board.SOLUTION: There is provided a cyanate ester compound having a diarylene [b,d]furan structure, where at least one arylene group of two arylene groups forming the diarylene [b,d]furan structure has a naphthylene skeleton and both of the two arylene group have an a cyanato group on their aromatic ring.SELECTED DRAWING: None
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