首页> 外国专利> CYANATE ESTER COMPOUND, CYANATE ESTER RESIN, MANUFACTURING METHOD OF CYANATE ESTER COMPOUND, CURABLE RESIN COMPOSITION, CURED ARTICLE THEREOF, ADHESIVE FILM FOR BUILD UP, SEMICONDUCTOR ENCAPSULATION MATERIAL, PREPREG AND CIRCUIT BOARD

CYANATE ESTER COMPOUND, CYANATE ESTER RESIN, MANUFACTURING METHOD OF CYANATE ESTER COMPOUND, CURABLE RESIN COMPOSITION, CURED ARTICLE THEREOF, ADHESIVE FILM FOR BUILD UP, SEMICONDUCTOR ENCAPSULATION MATERIAL, PREPREG AND CIRCUIT BOARD

机译:氰酸酯化合物,氰酸酯树脂,氰酸酯化合物的制造方法,可固化树脂组成,固化的制品,用于胶粘的胶粘膜,半导体封装材料,预浸料和电路板

摘要

PROBLEM TO BE SOLVED: To provide a cyanate ester compound small in dielectric constant and dielectric loss tangent of the resulting cured article and excellent in heat resistance, pyrolytic property and fire retardance, a cyanate ester resin, a manufacturing method of the cyanate ester compound, a curable resin composition, a cured article thereof, an adhesive film for build up, a semiconductor encapsulation material, a prepreg and a circuit board.SOLUTION: There is provided a cyanate ester compound having a diarylene [b,d]furan structure, where at least one arylene group of two arylene groups forming the diarylene [b,d]furan structure has a naphthylene skeleton and both of the two arylene group have an a cyanato group on their aromatic ring.SELECTED DRAWING: None
机译:解决的问题:为了提供所得到的固化物的介电常数和介电损耗角正切小且耐热性,热解性和阻燃性优异的氰酸酯化合物,氰酸酯树脂,该氰酸酯化合物的制造方法,固化性树脂组合物,其固化物,用于形成的粘合膜,半导体封装材料,半固化片和电路板。解决方案:提供具有二芳撑[b,d]呋喃结构的氰酸酯化合物,其中形成二亚芳基[b,d]呋喃结构的两个亚芳基中的至少一个亚芳基具有亚萘基骨架,并且两个亚芳基均在其芳环上具有氰基。

著录项

  • 公开/公告号JP2016117670A

    专利类型

  • 公开/公告日2016-06-30

    原文格式PDF

  • 申请/专利权人 DIC CORP;

    申请/专利号JP20140257341

  • 发明设计人 SATO YASUSHI;TAKAHASHI AYUMI;

    申请日2014-12-19

  • 分类号C07D307/77;C08G73/06;C08L79/04;C08K3/00;C08J5/24;C09J7/02;C09J11/06;C09J179/04;H05K1/03;C07B61/00;

  • 国家 JP

  • 入库时间 2022-08-21 14:45:02

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号