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Integrated circuit (IC) module comprising an integrated circuit (IC) package and an interposer with embedded passive components
Integrated circuit (IC) module comprising an integrated circuit (IC) package and an interposer with embedded passive components
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机译:集成电路(IC)模块,包括集成电路(IC)封装和具有嵌入式无源元件的中介层
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摘要
An integrated circuit (IC) module that includes an integrated circuit (IC) package, a plurality of first solder interconnects coupled to the IC package, an interposer coupled to the IC package through the plurality of first solder interconnects a plurality of second solder interconnects coupled to the interposer; and a printed circuit board (PCB) coupled to the interposer through the plurality of second solder interconnects. The interposer includes an encapsulation layer, a first passive component at least partially embedded in the encapsulation layer, and a plurality of interconnects coupled to the first passive component. The encapsulation layer includes a mold and/or an epoxy fill. The first passive component is configured to operate as an electronic voltage regulator (EVR) for the IC module. In some implementations, the interposer is a fan out interposer.
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