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Preparation methods for semiconductor layer and TFT, TFT and array substrate comprising semiconductor layer

机译:半导体层以及TFT的制备方法,薄膜晶体管以及包括半导体层的阵列基板

摘要

Embodiments of the present disclosure provide preparation methods for a semiconductor layer and a TFT, a TFT and an array substrate. The preparation method for a semiconductor layer includes forming a silicon dioxide film on a substrate; forming sidewalls at two ends of the semiconductor layer to be formed by patterning process; performing amination treatment on the sidewalls so that an aminosiloxane monolayer self-assembly is formed on the surface of the sidewalls; carboxylating a carbon nanotube solution and making the carboxylated carbon nanotube solution on the surface of the substrate with the sidewalls formed to form a carbon nanotube film; removing portions of the carbon nanotube film other than the portion between the sidewalls to form a semiconductor layer.
机译:本发明实施例提供了一种半导体层和TFT的制备方法,TFT和阵列基板。一种半导体层的制备方法,包括在基板上形成二氧化硅膜;以及通过构图工艺在要形成的半导体层的两端形成侧壁。在侧壁上进行胺化处理,从而在侧壁的表面上形成氨基硅氧烷单层自组装。羧化碳纳米管溶液,并在形成有侧壁的基板表面上制备羧化碳纳米管溶液,以形成碳纳米管膜。去除碳纳米管膜的除侧壁之间的部分以外的部分,以形成半导体层。

著录项

  • 公开/公告号US10431692B2

    专利类型

  • 公开/公告日2019-10-01

    原文格式PDF

  • 申请/专利权人 BOE TECHNOLOGY GROUP CO. LTD.;

    申请/专利号US201615533128

  • 发明设计人 HU MENG;

    申请日2016-05-20

  • 分类号H01L27/12;H01L27/32;H01L29/66;H01L51/05;H01L51;H01L29/08;H01L35/24;H01L29/786;H01L29/417;H01L29/423;H01L29/45;H01L29/49;

  • 国家 US

  • 入库时间 2022-08-21 12:15:43

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